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| DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D168 BZG04 series Transient voltage suppressor diodes Product specification Supersedes data of 1996 Sep 19 2002 Jul 04 Philips Semiconductors Product specification Transient voltage suppressor diodes FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * UL 94V-O classified plastic package * Transient suppressor stand-off voltage range: 8.2 to 220 V for 32 types * Shipped in 12 mm embossed tape. DESCRIPTION DO-214AC surface mountable package with glass passivated chip. BZG04 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. handbook, 4 columns Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. ,, ,, ,, k cathode band a Top view Side view MSA473 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PRSM PARAMETER non-repetitive peak reverse power dissipation storage temperature junction temperature CONDITIONS 10/1000 s exponential pulse (see Fig.4); Tj = 25 C prior to surge; see also Fig.2 MIN. - MAX. 300 UNIT W Tstg Tj -65 -65 +175 +175 C C 2002 Jul 04 2 Philips Semiconductors Product specification Transient voltage suppressor diodes ELECTRICAL CHARACTERISTICS Total series Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS IF = 0.5 A; see Fig.3 MIN. - BZG04 series MAX. 1.2 V UNIT Per type Tj = 25 C unless otherwise specified. REVERSE BREAKDOWN VOLTAGE V(BR)R (V) at Itest MIN. BZG04-8V2 BZG04-9V1 BZG04-10 BZG04-11 BZG04-12 BZG04-13 BZG04-15 BZG04-16 BZG04-18 BZG04-20 BZG04-22 BZG04-24 BZG04-27 BZG04-30 BZG04-33 BZG04-36 BZG04-39 BZG04-43 BZG04-47 BZG04-51 BZG04-56 BZG04-62 BZG04-68 BZG04-75 BZG04-82 BZG04-91 BZG04-100 BZG04-110 BZG04-120 BZG04-130 2002 Jul 04 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28 31 34 37 40 44 48 52 58 64 70 77 85 94 104 114 124 138 153 TEMPERATURE COEFFICIENT SZ (%/K) at Itest MIN. 0.05 0.05 0.05 0.05 0.05 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.07 0.07 0.07 0.07 0.08 0.08 0.08 0.08 0.09 0.09 0.09 0.09 0.09 0.09 0.09 MAX. 0.09 0.10 0.10 0.10 0.10 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.12 0.12 0.12 0.12 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 3 TEST CLAMPING VOLTAGE CURRENT Itest (mA) 50 50 50 50 50 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 10 5 5 5 5 5 5 5 V(CL)R (V) at IRSM (A) note 1 MAX. 14.8 15.7 17.0 18.9 20.9 22.9 25.6 28.4 31.0 33.8 38.1 42.2 46.2 50.1 54.1 60.7 65.5 70.8 78.6 86.5 94.4 103.5 114 126 139 152 167 185 204 224 20.3 19.1 17.7 15.9 14.4 13.1 11.7 10.6 9.7 8.9 7.9 7.1 6.5 6.0 5.5 4.9 4.6 4.2 3.8 3.5 3.2 2.9 2.6 2.4 2.2 2.0 1.8 1.6 1.5 1.3 REVERSE CURRENT at STAND-OFF VOLTAGE IR (A) MAX. 20 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 at VR (V) TYPE NUMBER Philips Semiconductors Product specification Transient voltage suppressor diodes BZG04 series TYPE NUMBER REVERSE BREAKDOWN VOLTAGE V(BR)R (V) at Itest MIN. 168 188 208 228 251 TEMPERATURE COEFFICIENT SZ (%/K) at Itest MIN. 0.09 0.09 0.09 0.09 0.09 MAX. 0.13 0.13 0.13 0.13 0.13 TEST CLAMPING VOLTAGE CURRENT Itest (mA) 5 5 2 2 2 V(CL)R (V) at IRSM (A) note 1 MAX. 249 276 305 336 380 1.2 1.1 1.0 0.9 0.8 REVERSE CURRENT at STAND-OFF VOLTAGE IR (A) MAX. 5 5 5 5 5 at VR (V) 150 160 180 200 220 BZG04-150 BZG04-160 BZG04-180 BZG04-200 BZG04-220 Note 1. Non-repetitive peak reverse current in accordance with "IEC 60-1, Section 8" (10/1000 s pulse); see Fig.4. THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 note 2 Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer 35 m, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.5. For more information please refer to the "General Part of associated Handbook". CONDITIONS VALUE 25 100 150 UNIT K/W K/W K/W 2002 Jul 04 4 Philips Semiconductors Product specification Transient voltage suppressor diodes GRAPHICAL DATA BZG04 series 104 handbook, halfpage PZSM (W) 103 MBH452 handbook, halfpage 3 MBH453 IF (A) 2 102 1 10 10-2 10-1 0 1 tp (ms) 10 0 1 VF (V) 2 Tj = 25 C prior to surge. Tj = 25 C. Fig.2 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Fig.3 Forward current as a function of forward voltage; typical values. IRSM handbook, halfpage (%) 100 90 50 4.5 50 2.5 50 10 t t1 t2 MGD521 1.25 MSB213 In accordance with "IEC 60-1, Section 8". t1 = 10 s. t2 = 1000 s. Dimensions in mm. Fig.4 Non-repetitive peak reverse current pulse definition. Fig.5 Printed-circuit board for surface mounting. 2002 Jul 04 5 Philips Semiconductors Product specification Transient voltage suppressor diodes PACKAGE OUTLINE Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors BZG04 series SOD106 H D A A1 c Q E b (1) 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 2.3 2.0 A1 0.05 b 1.6 1.4 c 0.2 D 4.5 4.3 E 2.8 2.4 H 5.5 5.1 Q 3.3 2.7 Note 1. The marking band indicates the cathode. OUTLINE VERSION SOD106 REFERENCES IEC JEDEC DO-214AC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-09 2002 Jul 04 6 Philips Semiconductors Product specification Transient voltage suppressor diodes DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS BZG04 series This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 Jul 04 7 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/04/pp8 Date of release: 2002 Jul 04 Document order number: 9397 750 09765 |
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